ThermoGrip® H1865

Description

High performance. Cost-effective use. This hot melt adhesive has a wide temperature resistance, excellent adhesion and clean processability. With high hot tack, it bonds in a variety of conditions, including short compression times. It also offers superior bonding to a variety of substrates, including high memory and dense board stocks.

Benefits

• Fast, reliable bonding
• Reduced manufacturing, material and labor costs
• Increased manufacturing flexibility

Resources

• Product Sell Sheet

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